MSP430G2333 Microprocessor Flash Memory Cracking will disable the fuse bit protection over its memory, and recover embedded firmware from msp430g2333 microcontroller, heximal file will be deciphered from MCU MSP430G2333;
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to the TEST pin when blowing the JTAG fuse which is a common method when readout msp430f2352 microcontroller program.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse duration of the specified maximum frequency. Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
