Extract IC Security Fuse from secured microcontroller, and disable its protection system functions by MCU breaking method, and then clone IC chip with the exactly same functions;
IC code extraction can be diversify as three different ways like semi-invasive mcu crack, un-invasive mcu unlocking, invasive ic breaking. And ultra-violet radiation is the most ancient way of this industry.
Ultra-violet IC cracking method can be separated into two different ways: first is orientate the security fuse location second is extract the IC with ultra-violet radiation.
Hereby we can talk about how to locate the security fuse
, we can separate the security fuse with the main memorizer physically or embed into the memorizer grid. There are different ways to locate the security fuse locations.
Generally speaking, but very time and money consuming method is turn the IC upside down and reverse engineering for the purpose of mcu binary extraction. However, the partial reverse engineering can save a lot of time and energy. For example, the high voltage for the IC programming provided from outside pinout can be used to trace all the memorizer units, include the security fuse.
In the microscopy there is easy to trace and locate the security fuse inside the IC with 0.8 micron technology. If the IC has thinner track space especially the manufacturing by surface technology, it is not feasible to have the optical analysis on it and reverse engineering on the IC is necessary.
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