Extract Chip by Laser Cutting & Focus Ion Beam

When extract chip, we will normally find the deactivation layer cover on the aluminum wire connection internally, so the deactivation layer must be removed. The most convenient method is using laser cutting to remove the deactivation layer which is a critical step for MCU Cracking.

Ultra-sonic laser cutting can be used to remove the POLYIMIDE or other organic layer which are generally will existence on the top of deactivation layer. Ultra-sonic laser cutting can also be use to strip off the deactivation layer, for example, green laser being used to cut the metal wire, and red laser being use to cut top layer metal and make access to the second metal layer.

Focus Ion Beam

As for the chip with 0.5micron or below need more effective and advanced facility to establish the internal wire connection for MCU ATMEGA162L Code Reading. That is the focus ion beam station which can not only build the test point, it can also being used to image and recover when extract chip. In the failure analysis, focus ion beam can be used to cross section and failure analysis. It has very good space resolution and preciseness which is very important for chip extract, its preciseness and space resolution is good enough to make detecting point on the crystal transistor on the chip with sub-micron technology in the process of Extract MCU ATMEGA8P Code.

Focus Ion beam work station for chip extract include a vacuum chamber, a electronic gun through which the gallium ion inject out from the liquid cathode and make it to beam which has 5 to 10 nano meter for extract chip. Through increase the electricity level of ion beam the chip material can be removed and cut off.